Advanced Material Machinery
FCCL Plazma Treatment Machine
FCCL 플라즈마 처리기
The FCCL plasma treatment machine improves the adhesion of the PI layer by irradiating its surface with a plasma gas beam. After plasma treatment, the material can be effectively used in edge slitting and inspection processes, and it also facilitates the removal of organic contaminants from the PI surface.
Specifications
| 구분 | 사양 |
|---|---|
| Base Material |
Copper foil (rolled and electrolytic), PI film, FCCL
|
| Material Thickness |
FCCL: 24–60 µm Copper Foil: 12–35 µm PI Film: 12–25 µm
|
| Web Width |
Max. 540 mm
|
| Roll Width |
650 mm
|
| Machine Speed |
10 m/min
|
| Slitting Width |
Max. 520 mm
|
