LED Die Bonder

LED Die Bonder


This equipment is a bonding machine at high-speed lead frames 
for semiconductor chips that have finished sewing of semiconductor wafers .

Machine Specifications


  General Specification
System Capability Cycle Time : 180ms
X,Y Placement ±35㎛ under
Wafer 6” Standard (8” Option)
Material Die Size : 0.15×0.15 ~ 5.08~5.08mm
Vision 256 Gray Level ( Resolution : 480×480  Pixel )
Bonding Force 30~ 300g (Programmable)
Dimension 1,600(L) × 1,300(W) × 1,700(H)
LED 다이 본더